Differential Scanning Calorimetry (DSC)
Thermogravimetric Analysis (TGA)
Dynamic Mechanical Analysis (DMA)
Thermal Mechanical Analysis (TMA)

Differential Scanning Calorimetry (DSC)

In DSC experiment, the temperatures and heat flows associated with thermal transitions in a material will be measured.  The DSC date provides important information on the material properties like glass transitions, phase transitions, crystallization, phase changes, melting, stability, kinetics, and etc.

Thermogravimetric Analysis (TGA)

TGA measures the loss of sample weight against temperature.  It provides valuable information on the thermal stability of a material.  In addition, by examining the decomposition temperature of various components within the sample, quality as well as quantitative data about the sample components can be obtained.

Dynamic Mechanical Analysis (DMA)

The mechanical properties of materials as a function of time, temperature, and frequency can be accurately measured by Dynamic Mechanical Analysis (DMA).  Typical application examples are: analysis of the viscoelastic nature of polymers and determination of the sample modulus.

Thermal Mechanical Analysis (TMA)

TMA is a specific technique to measure the dimensional changes of a sample (such as expansion or contraction) upon heating, cooling or at a fixed temperature under almost zero or definite loading. Common applications include determination of coefficient of thermal expansion (CTE), glass transition temperature (Tg) and softening temperature. Other specific applications include studies of delamination or swelling in solvents of printed circuit boards (PCB).